MicroSense non-contact capacitive sensors are ideal for precise, linear position measurements and linear displacement sensing
MicroSense in-line measurement modules offer unparalled throughput and stability for measurement of solar wafer thickness and TTV.
Our award winning Vibrating Sample Magnetometers are the easiest to use and most sensitive VSMs available.
MicroSense offers a suite of automated magnetic measurement tools for in-plane and perpendicular STT-MRAM development and production including:
Wafer measurement systems from MicroSense provide precise measuremet of wafer thickness and shape. Ideal for materials including sapphire, silicon, GaAs, InP, and SiC.
MicroSense has a singular focus on precision measurement. We provide customers with state-of-the-art measurement performance in our products - precision capacitive sensors for high resolution, non-contact position sensing; vibrating sample magnetometers and MOKE systems for magnetic property measurement; and wafer metrology systems for accurately measuring wafer thickness and shape.
The MicroSense UltraMap C200A is an automated LED Sapphire Wafer Measurement system based on MicroSense’s proprietary two sided capacitive sensing technology. The system measures critical substrate parameters including Thickness, TTV, Bow, Warp and Local Thickness Variation (LTV) with high throughput. The UltraMap C200 is designed for sapphire wafer manufacturers and LED chip makers who require better wafer geometry inspection with higher measurement repeatability, compared to traditional optical metrology systems.
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